型号:

0192890026

RoHS:无铅 / 符合
制造商:Molex Inc描述:KRIMPING DIE HHL-J-760-E1
详细参数
数值
产品分类 工具 >> 压接器,施用器,压力机 - 配件
标准包装 1
系列 *
其它名称 019289-0026
192890-0026
192890026
相关参数
CPT30090 Microsemi Power Products Group DIODE SCHOTTKY 90V 300A MD3CC
IP4364CX8/LF,135 NXP Semiconductors IC FILTER/ESD PROT 3CH WLCSP8
4227 Keystone Electronics BREADBOARD 1/32" 4.50X6.00"L
AS5145H-HSST ams IC ENCODER ROTARY 16-SSOP
2DM310 Honeywell Sensing and Control SWITCH SNAP MOM DPDT 10A QC
CPT30040 Microsemi Power Products Group DIODE SCHOTTKY PWR MODULE 40V
UFT12520 Microsemi Power Products Group DIODE MODULE ULT FAST 200V
0192890024 Molex Inc KRIMPING DIE HHL-H-750-E2
AS5145-HSST ams IC ENCODER PROG 12-BIT 16-SSOP
84P44 Vector Electronics PC BOARD CEM1 EPOXYGLASS 4.5X8.5
MAF95109 Laird Technologies IAS ANT EMB NANO 802.11BA IPEX
PEMI2QFN/WT,115 NXP Semiconductors IC RC FILTER NETWORK 2CH 6XSON
UGE0421AY4 IXYS DIODE 3200V 22.9A UGE SINGLE
AS5145B-HSST ams IC ENCODER ROTARY 12-BIT 16-SSOP
MAF94385 Laird Technologies IAS ANT DIPOL WRR 2.5GHZ U.FL
22SM396-T Honeywell Sensing and Control SWITCH PLUNGER SPDT 5A SOLDER
AS5145A-HSST ams IC ENCODER ROTARY 10-BIT 16-SSOP
MAF95081 Laird Technologies IAS ANT EMB NANO 802.11BG IPEX
0192890023 Molex Inc KRIMPING DIE HHL-H-750-E1
64P44 Vector Electronics PC BOARD CEM-1 EPOXYGLSS 4.5X6.5